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Sr Packaging Engineer for SanDisk Corporation, Malaysia

Qualification :

Bachelor degree or above in Mechanical/Material/ Electrical/ Physics Engineering
5+ years of process engineering experience in semiconductor assembly and test manufacturing plant.
Be familiar with memory product (Flash is preferred)
Accept flexible working time.
To be based at Penang, Malaysia

Competencies :

Must have experience and knowledge at Package Assembly & testing
Experience on high die stack up to 8-16Dies & electrical- physical failures correlation.
Define baseline defects matrix for sustaining engineering.
Basic understanding of package level quality & reliability.
Proficient in standard business application software, Tools & standard engineering method (Word, Excel, PowerPoint, AutoCAD, JMP, SPC, DOE, DMAIC, 8D,5-why etc.).
A proven desire to work as a team member, both on the same team and outside of the team.
Ability to troubleshoot and analyze complex problems.
Ability to multi-task and meet deadlines.
Excellent English communication (written and verbal) and interpersonal skills.

5+ years experience

Shashidhar S
Sandisk India Device Design Centre Pvt Ltd

hr-india@sandisk.com

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